Copper etching solution "GHP-3" "BTF-3"
Smooth finish, minimal change in Cu surface roughness.
It is suitable for etching Cu/Ti seed layers after Cu plating, and it is also possible to etch Cu and Ti simultaneously. Additionally, it has a minimal impact on transmission loss as it does not compromise the smoothness of the Cu surface. 【Features】 ■ The smoothness before etching is not compromised ■ Minimal shape change due to over-etching *For more details, please feel free to contact us.
